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In Chapter 5, students learned how the process of dissolving different substances can result in an increase or decrease in temperature. In Chapter 6, students saw that different chemical reactions can also be exothermic or endothermic. This engineering design lesson gives students an opportunity to apply these temperature-changing chemical processes to the problem of making a device to achieve and maintain a particular temperature range for a very specific purpose. This lesson is expected to take approximately two class periods plus additional time for students to imagine, draw, and describe their temporary portable reptile egg incubator.
This lesson begins with a story about rescuing reptile eggs from a new construction site. Using the story as motivation, students are presented with an engineering design challenge: Build a portable device which can warm, support, and protect one reptile egg as it is moved from a construction site to a nearby reptile conservation center. After observing different heat packs, students discuss the criteria and constraints related to designing a heat pack as the basis for their device. Students investigate calcium chloride as an exothermic dissolver, and then move on to calcium chloride and baking soda as the exothermic chemical reaction which will serve as the heat source for their device.
Students adjust the amounts of the reactants (water, calcium chloride and baking soda) to achieve the right temperature range and then test a prototype in a sealed zip-closing plastic bag. Students use their findings and ideas about insulation and heat transfer to draw an optimized design that 1) Keeps an egg at the ideal temperature, 2) Holds an egg in the proper orientation, and 3) Protects the egg from impact. Each student or student group draws this device and explains how the device meets each of the three criteria.
In the story, the eggs need to be moved while they are protected and kept at a specific temperature range. Students observe heat packs that use different chemical processes as possible heat sources for their device. As a class, students identify the features the device should have to be successful (criteria) as well as the factors that might limit or impede the development of a successful design (constraints).
The following story is included on the Student Activity Sheet. This story introduces the design challenge and serves as motivation for the lesson. Either read it aloud or have students read it silently.
You have talked with construction workers at a site who agreed to notify you if they find reptile eggs. The center is able to incubate the eggs until the babies hatch and then return them to the wild. Your role is to design a reptile egg incubation device that keeps an egg warm and safe as it is transported from the worksite to the reptile conservation center.
Another type of hand warmer contains a solution of the chemical sodium acetate and a small metal disc. When the disc is bent, crystals of sodium acetate begin to form. This process of changing from a liquid to a solid produces heat.
Remind students that their challenge is to make a heat pack to warm and safely transport snake eggs. Explain that next they will conduct the chemical reaction in a sealed bag to see if the temperature and amount of gas produced will do the job. Would the chemical reaction you tested in this lesson work if it were sealed in a plastic bag? Sealing the chemicals in a plastic bag would mean that you would be able to bring just the portable reptile egg incubator with you rather than carry all the supplies needed for each of your tests. In this activity, students combine calcium chloride and baking soda in a zip-closing plastic bag to see if this design will keep reptile eggs warm.
Data helps teams visualize whether their designs meet specifications. The data display and analytics capabilities in PathWave ADS produce graphs, charts, and diagrams to give you design confidence. Quickly accelerate your design with wizards, design guides, and templates. The complete design flow includes schematic, layout, circuit, electro-thermal, and electromagnetic simulations.
Signal and power integrity are becoming more important as frequency and speed increase in printed circuit boards (PCBs). Losses associated with transmission line effects can cause failures in electronic devices. Modeling traces, vias, and interconnects are necessary to simulate the board accurately. Improve high-speed link performance in PCB designs with integrated circuit design and electromagnetic simulators customized for power and signal integrity analysis.
Power supplies, solar inverters, and electric vehicles are driving the need for more efficiency in power device designs. The technology that enables an increase in efficiency is wide-bandgap materials such as Silicon Carbide and Gallium Nitride. Model modern materials and switch-mode power supplies to optimize power device designs for maximum efficiency.
The new HyperWorks experience was created to free engineers to move from physics to physics, domain to domain, and even create reports without ever leaving their model. Create, explore and optimize designs within HyperWorks to produce robust designs that accurately model structures, mechanisms, fluids, electromagnetics, electrical, embedded software, systems design and manufacturing processes.
The solution specific workflows enhance a growing number of engineering processes including fatigue analysis, concept design optimization, CFD modeling, and design exploration. Each provides a meticulously designed and intuitive user interface, differentiated for each user profile, while remaining consistent and easy-to-learn.
Intuitive direct modeling for geometry creation and editing, mid-surface extraction, surface and midmeshing, and mesh quality correction, combined with efficient assembly management provide all the capabilities required for fast, accurate model creation and evaluation of design alternatives and product variants in less time.
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ENERVEX offers complete exhaust solutions by combining exhaust/chimney system, mechanical exhaust and heat recovery needed to complete a project. Through a single supplier. For any boiler, generator, oven, process/industrial oven, fuel cell, melter, kitchen hood, fireplace, wood stove, .....
Making these determinations is a key requirement for a design that delivers a good PC user experience. And also, these thresholds help to choose the first mitigating action to take for PC components that reside in multiple thermal zones.
When designing and modeling the hardware, take into account the parameters mentioned in the preceding list. Please use worst-case values for the environment. The only parameter that can be directly controlled by software is the workload.
Consider a PC's thermal behavior when it is running a constant workload. As the workload starts, the PC's hardware components such as the CPU and GPU generate heat and increase the temperature. As the temperature increases relative to the ambient temperature, the PC starts to dissipate heat faster until eventually the heat generation is equal to the heat dissipation, and the temperature reaches steady state. For the entire duration of this constant workload, since there is no throttling involved, the performance and throughput are constant.
The following diagram shows the relationship between heat generation, temperature, and performance when no throttling is involved. Notice that the PC's temperature stays within the thermal envelope, as bounded by the ambient temperature and throttling temperature.
In both cases shown in the preceding diagrams, the workloads must operate within a thermal envelope to ensure that the system temperature does not exceed safe limits. The envelope starts with the ambient temperature and ends with the throttling temperature. Also in both cases, the heat generation and dissipation eventually reach a balanced state, and the system temperature is stabilized.
A well-designed PC should have as large of a thermal envelope as possible, providing users a long-lasting, mitigation-free experience. As shown in the preceding diagrams, the thermal envelope has a lower bound determined by the ambient temperature. It is bounded above by the throttling temperature. While the ambient temperature is not a variable that system designers can control, the upper bound can be pushed higher by good hardware design. For more information, see Hardware thermal modeling and evaluation. But even assuming that hardware is not the major limitation, other important factors must be considered when defining the thermal envelope.
When designing hardware, it's of key importance to keep thermal management in mind. Selecting low-power parts, placing hot components far from one another, and incorporating thermal insulation are only a few examples of how hardware can greatly improve the thermal experience. These methods cannot be replaced in software. As such, the software solution only serves as a complement to the hardware design in the overall thermal experience. 2ff7e9595c
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